DIP series

Production Overview      DIP（Dual-In-line packages） have been an industry standard for a long time. The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using TH ( through hole) and assembly, DIP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs.   Key Features    PKG TYPE DIP300mil DIP400mil DIP600mil DIP750mil Lead Count 8~24 28/32 24/28/42/48/52 64/88 LF Material Cu Cu Cu Cu Body Width (mm) * (mm) 7.62 10.16 15.24 19.05/19.50 Body Thickness 3.30 3.30/3.80 3.81 3.80 Lead pitch (mm) 2.54/1.778 1.778 2.54/1.778 1.778/1.27 (1mm=39.37mil; 1mil=25.4um) * The width of DIP is the distance of shoulder-to-shoulder.   Reliability Test Standards The test criterion is zero defect out of 77 sampling units. Temp/Humidity Test 85°C/ 85% RH,  JEDEC 22- A101 Pressure Cooker Test 121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102 Temp Cycle Test -65 ~ 150°C, JEDEC22-A104 High Temp Storage Test 150°C, JEDEC 22- A103 High Accelerated Stress Test 130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118